Goldman Sachs analysts predict that the latest artificial intelligence-optimized chips from Nvidia will provide a significant boost to Taiwan Semiconductor Manufacturing Company (TSMC). Nvidia, a California-based company, recently introduced its new chip architecture named “Rubin,” which is expected to be available for shipping in 2026. This announcement comes before the release of Nvidia’s next generation data center processors known as “Blackwell,” which is set to follow the previously introduced “Hopper” chips in just over a year.
Nvidia has experienced tremendous growth, adding approximately $350 billion in market value following the strong revenue report last month. The intense competition in the semiconductor market from companies like Advanced Micro Devices, Intel, Alphabet, and Microsoft is pushing Nvidia to continuously innovate. According to Goldman Sachs analysts, TSMC’s advanced 3-nanometer nodes will likely be utilized by Nvidia in the Rubin platform to improve chip performance. In addition, future products after Rubin could make use of TSMC’s cutting-edge 2-nanometer chips as well.
Goldman Sachs analysts believe that investor sentiment towards artificial intelligence remains positive, with expectations for new applications beyond chatbots like OpenAI’s ChatGPT. They see TSMC as a key beneficiary of this trend due to its leadership position in chip manufacturing. With its strong capabilities in meeting the growing demand for higher power and computing performance in AI applications, TSMC is poised to remain a valuable asset in the evolving semiconductor industry.
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