Alchip Technologies recently showcased their advanced technology and chiplet design plans at the TSMC 2024 North America Technology Symposium held in Santa Clara, CA and Austin, TX. They will also be present at upcoming TSMC NA Technology Workshops in Boston, as well as Technology Symposiums in Europe, Taiwan, China, and Japan.
At their booth, Alchip emphasized their expertise in high-performance computing design and discussed their success across multiple complex projects, including full reticle size designs over 800mm² on cutting-edge FinFET technology. They also shared details on their advanced package production, such as CoWoS® designs on advanced nodes and packages exceeding 70x80mm2 in production.
Alchip highlighted their industry partnerships, including membership with TSMC Open Innovation Platform® Value Chain Alliance and 3DFabricTM Alliance. The company has established itself as a high-performance ASIC leader through their advanced 2.5D/3DIC design, CoWoS/chiplet design, and manufacturing management capabilities.
Founded in 2003 and headquartered in Taipei, Taiwan, Alchip Technologies is a global provider of silicon design and production services for system companies developing complex ASICs and SoCs. They offer faster time-to-market and cost-effective solutions for SoC design at both mainstream and advanced process technology nodes. Alchip serves customers in various industries, including AI, HPC/supercomputing, mobile phones
+ There are no comments
Add yours